The packaging of the Core i9-13900K appeared in the photo – the kit will again have a fake silicon wafer

Intel will use new packaging for the flagship Core i9-13900K processors – a Japanese source published its photo. Chips of the new generation, Intel will officially present next week.

Image Source: VideoCardz

The flagship Raptor Lake-S processors will ship in compact boxes with signature blue coloring and a minimalistic design. The boxed version of the Core i9-13900K will still include a fake silicon wafer, which is used as a reflective element. It started shipping with Alder Lake-S processors. For new processors, the color of the plate has changed from gold to silver.

For the past several generations of Intel Core processors, boxed versions of flagship K-series models have had a different packaging design than other processor boxes. The latter are usually content with simple boxes without any design frills.

Boxed version of the flagship 9th generation Intel Core

Boxed version of the flagship 11th generation Intel Core. Image Source: Intel

Boxed version of the flagship 11th generation Intel Core

The packaging of an unusual appearance (in the image below) of the third iteration for the flagship Core i9-12900K chip was replaced by the company with a regular one without frills only recently, in August.

Boxed version of the flagship 12th generation Intel Core

Boxed version of the flagship 12th generation Intel Core

The use of more compact packaging of new Intel processors is not only aesthetic, but also practical. Thus, the manufacturer will be able to supply processors in a larger volume as part of one batch. The same AMD may have problems with this, since it decided to use very large boxes for older models of Ryzen 9 7000 processors.

Image Source: AMD

Image Source: AMD

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The article is in Russian

Tags: packaging Core i913900K appeared photo kit fake silicon wafer

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